Pneumatic components for semiconductor and electronics manufacturing
Pneumatic automation controls wafer handling, bonding head actuation, chuck clamping, process gas flow and spindle cooling.
| Application | Recommended products |
|---|---|
| Wafer/substrate handling | Fabco-Air Pancake, Square1; Tolomatic MG sealed cylinder |
| Process gas pressure control | Fairchild Model 10/30/50/70B regulators; E/P transducers |
| Directional control manifolds | ROSS Controls ISO valve manifolds; FLEX serial bus |
| Air preparation | ROSS Controls FRL, 5-micron filtration |
| Spindle/chuck rotary unions | Deublin single and multi-passage rotary unions |
| Vacuum generation | Air-Mite vacuum ejectors Series 60-240 |
| Energy isolation | ROSS L-O-X lockout valves; Air-Mite LV3 |
| Silicone-free fittings | Legris LF3600; FEP tubing |